Package printed circuit board (PCB) / Chip-on-Board (COB)
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
At Sato-sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity and reduces discoloration caused by thermal degradation during assembly and use. We have a lineup that includes "COB for optical communication," "package printed circuit boards," and "ultra-thin multilayer printed circuit boards." *For more details, please contact us or download the catalog.*
- Company:サトーセン
- Price:Other